Insight Product Company offers Microwave Silicon Limiter PIN Diodes with p+-i-n+ structures are designed to be used in microwave protective devices included in hybrid integrated circuit (HIC) hermetically sealed, design of which provides protection against moisture, salt, fog, mycelial fungus, hoarfrost, dew, decreased and increased pressure.
Electrical Specification @ +25°C
In the process of chip bonding into HIC "minus" electrode should be soldered using acid-free flux at temperature no more than +
270 °C during no more than 5 sec.
The glue should have the following characteristics: bulk resistance no less than 0.0004 Ohm, thermal resistance 6.7 - 7 C/W, thermal conductivity 29 WmK
Thermocompression bonding is recommended. Wire diameter and ribbon width have to be less than anode contact diameter.
Typical pressure in microwelding has to be no less than 20 grams and no more than 30 grams.
A stage should be heated up to about 350°C. Mounting of “plus” contact is admitted by microwelding.
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